Silicon Run I (1996)

1. Introduction to Semiconductor Manufacturing:

• Semiconductors are materials that have electrical conductivity between that of a conductor (like copper) and an insulator (like glass). Silicon, the most commonly used semiconductor material, is abundant and ideal for making integrated circuits (ICs).
• Integrated Circuits (ICs) are tiny electronic circuits on a semiconductor chip. They are used in virtually every electronic device, including computers, phones, and medical equipment.

2. Raw Silicon to Wafer Production:

• Purification of Silicon: The process begins with raw silicon, which is refined to a high-purity form known as electronic-grade silicon.
• Crystal Growth: High-purity silicon is melted and formed into large cylindrical crystals through a process called the Czochralski method. These silicon crystals are then sliced into thin wafers.
• Wafer Processing: The silicon wafers are polished to achieve a smooth surface for subsequent processing.

3. Photolithography:

• Photolithography is a key step in semiconductor manufacturing that involves transferring circuit patterns onto the wafer.
• Coating: The wafer is coated with a light-sensitive material called a photoresist.
• Masking and Exposure: A mask (a stencil of the circuit pattern) is used to selectively expose parts of the wafer to ultraviolet (UV) light, which changes the properties of the exposed photoresist.
• Etching: The unexposed areas of the photoresist are removed, and an etching process is used to etch away the silicon beneath the exposed areas, creating the circuit pattern.

4. Doping and Implantation:

• Doping is a process in which impurities are introduced into the silicon to modify its electrical properties. This is done to create regions within the wafer that are either positively charged (p-type) or negatively charged (n-type), which are essential for creating transistors.
• Ion Implantation: This technique precisely implants dopants into specific areas of the wafer.

5. Oxidation and Thin Film Deposition:

• Oxidation: A layer of silicon dioxide (SiO₂) is grown on the wafer, which serves as an insulator or a barrier in certain parts of the circuit.
• Thin Film Deposition: Various materials, such as metals or insulators, are deposited onto the wafer in thin layers. These materials form components like interconnects (wires that connect transistors) and gates.

6. Etching and Patterning: